General information | |
Type | CPU / Microprocessor |
Market segment | Desktop |
Family | AMD Phenom II X4 |
Model number | 965 |
CPU part numbers |
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Stepping codes | AACAC AC CACAC AC CACDC AC CACYC AC |
Frequency | 3400 MHz |
Bus speed | 667 MHz Memory controller One 2000 MHz 16-bit HyperTransport link (4 GT/s) |
Clock multiplier | 17 |
Package | 938-pin organic micro-PGA |
Sockets | Socket AM2+ Socket AM3 |
Introduction date | Nov 4, 2009 |
End-of-Life date | September 2012 |
Price at introduction | $195 |
Architecture / Microarchitecture | |
Microarchitecture | K10 |
Platform | Dragon |
Processor core | Deneb |
Core stepping | RB-C3 |
CPUID | 100F43 |
Manufacturing process | 0.045 micron silicon-on-insulator (SOI) technology 758 million transistors |
Die size | 258mm2 |
Data width | 64 bit |
The number of cores | 4 |
The number of threads | 4 |
Floating Point Unit | Integrated |
Level 1 cache size | 4 x 64 KB 2-way set associative instruction caches 4 x 64 KB 2-way set associative data caches |
Level 2 cache size | 4 x 512 KB 16-way set associative exclusive caches |
Level 3 cache size | Shared 6 MB 48-way set associative cache |
Cache latency | 3 (L1 cache) |
Virtual memory | 256 TB |
Multiprocessing | Uniprocessor |
Features |
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Low power features |
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Integrated peripherals / components | |
Integrated graphics | None |
Memory controller | The number of controllers: 1 Memory channels: 2 Channel width (bits): 72 Supported memory: DDR2-1066, DDR3-1333 DIMMs per channel: up to 2 Maximum memory bandwidth (GB/s): 21.3 |
Other peripherals | HyperTransport 3 technology |
Electrical / Thermal parameters | |
V core | 0.825V - 1.4V |
Maximum operating temperature | 55°C - 62°C |
Thermal Design Power | 125 Watt |
Notes on AMD Phenom II X4 965 (125W, BE) | |
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