Availability : In stock
£9.99
.
1 Pack Supplied, which includes:
1x New YAXUN YX-535 20ML BGA IC Epoxy Glue Adhesive Remover for Iphone/samsung
PLEASE DON'T BUY THIS ITEM IF NOT TECHNICIAN
Instructions
Applicable to softening and removing the mobile phone BGA IC chips and mainboard resin sealants. This product use new eco-friendly that can rapidly soften and loosen the cured phenolic aldehyde,epoxy,acrylic,polyurethane,silicone resin sealants. It causes no damage to mobile phone circuit boards or elements.
Usage: shake well before use. Take a proper amount of the adhesive removal solution carefully with a pipette,drip it into the sealant required for removal, place the mainboard and BGA IC horizontally for 5--10 minutes to soften the sealant and use a special tool to carefully peel off the soften sealant. Pay attention to the wiring around the BGA IC chip and mobile phone mainboard copper foil circuit when peeling off. Wash off the residual adhesive and solution on the chip mainboard after adhesive removal.
Caution:
1. This solution is weak acid. There is air pressure in the bottle. Open the bottle cap carefully.
2. Avoid get to eyes and skin. In case of that, rinse with lean water.
3. Store in a well-ventilated and low-temperature environment away from sunlight.
4. Keep out of reach of children . It should only be used by professionals. This product is nonflammable.
5.We are not liable for any loss or damage as this item is purely for professionals.
£9.99
1 Pack Supplied, which includes:
1x New YAXUN YX-535 20ML BGA IC Epoxy Glue Adhesive Remover for Iphone/samsung
Mobitools is trading name for Brit Lite Limited based in UK, specialist in mobile communication accessories and parts.
All goods are shipped directly from UK.
Mobitools is committed to provide professional products with after sales service.
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Monday - Friday: 11am - 6pm
Saturday: Close
Sunday: 11am - 4pm