Vertical hot-air-leveling

BECE HAL-BIC-FLUX 7059 has been specially developed for plating printed circuit boards on vertical hot-air-leveling systems. 

HAL-BIC-FLUX 7059 is extremely temperature resistant and is perfectly suited to Pb-free and Pb/Sn soldering methods. 
Thanks to the good activation and wetting properties, the light oxide layers are perfectly removed from the copper surface which 
allows you to achieve shiny and even soldering surfaces in just one dipping cycle.

HAL-BIC-FLUX 7059 reduces the surface tension and prevents tin streaks on one-sided circuit boards (e.g. CEM1), or on FR4 materials 
without a solder mask surface. 
HAL-BIC-FLUX 7059 prevents dirt on the machine caused by soldering splashes and does not display any reciprocal effects with 
solder resistant masks from leading manufacturers (such as discolouration or bleeding) and enables the best possible insulation resistances.

•  Outstanding wetting and activation properties  
•  Highly polished and even soldering surfaces
•  Very low system corrosion and no odours, 
   because HAL-BIC-FLUX 7059 does not contain hydrochloride acid.
•  Ideal for the SMD technique
•  Suitable for all vertical systems