The FPGA Micromodule integrates a leading-edge Spartan-3E 1600K gates FPGA, an USB2.0 microcontroller, DDR Ram, configuration Flash and power supply on a tiny footprint. A large number of configurable I/Os are provided via shock proof B2B mini-connectors.
Thus, the Micromodule is ideally suited for battery-powered and small-sized applications.
It is intended to be used as an OEM board, or combined with our carrier boards, the micromodule serves as a powerful system widely used for educational and research activities.
All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Software for SPI Flash programming over USB, as well as reference designs for high speed data transfer over USB are included.
You can find all Xilinx ISE versions here.
- Product Page - Overview of our TE0300 Series
- Trenz Electronic TE0300 Wiki
- Example projects
- Support Forum
All modules produced by Trenz Electronic are developed and manufactured in Germany.