* 100% brand new and high quality Aluminium RAM Heat sink.
* Great for high performance or over clocked systems.Motherboard DDR VGA RAM Memory IC Chipset ........
* Dissipates RAM heat improving its performance.
* Reduce the temperature of the memory by up to 35%.
* Effective size fits on all motherboards.
* Dimension: 28 x 28 x 13 mm.
* N.W: 9g
* Color: Green
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Thermal glue :
* Application:
apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink,VGA CARD Northbridge
Southbridge Heatsink.
* Features: thermal properties,
strong adhesion
* Melting capacity: 0 (200 ℃ / 24Hours)
* Evaporation: 0.001% (200 ℃ / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25 ℃)
* Strength of connected buildings: 25Kg
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: 200 ℃
* Net Weight: 5g
viscosity
control better, with just a little more force to remove the heat sink
(rotating around a few can be removed), removed after wipe clean with
paper towels.
Package Includes:
* 5x Aluminium Heat Sink
* 1x 5g thermal glue.