High Quality, Easy Print, Active Solder Paste 
Sn96.5% - Ag3% - Cu0.5%,  LEAD FREE

THIS AUCTION IS FOR: 1 Syringe: 8g - 1.4ml


  • A ''No Clean'' type paste:

  • Paste designed for soldering SMD components.
  • It exhibits good tackiness and wet ability of soldered surface.
  • The paste does not lose its physical and chemical properties even after being left for 20 hours on the PCB. 
  • Soldered joints have good mechanical and electrical properties. 

  • A ''No Clean'' type paste is designed for soldering SMD components introduction processes 
  • that do not include washing phase. 
  • Apart from metals powders, 
  • the product composition includes resin based and solvent based flux, 
  • activators that remove oxides and thixotropic additions,
  • responsible for viscosity and plasticity. 
  • The paste does not lose its physical and chemical properties even being left for 20 hours on the PCB. 
  • This time depends on condition in room: humidity and temperature. 

  • Additional properties of the paste:

  • - It does not contain chlorides.
- Flux residue neither corrodes, no requires washing.
  • - Soldered joints have good mechanical and electrical properties.

  • electronics
  • electrotechnics
  • automatic soldering
  • manual soldering
  • surface mounting
  • for automatic PCBs
  • for manual PCBs