High Quality, Easy Print, Active Solder Paste
Sn96.5% - Ag3% - Cu0.5%, LEAD FREE
THIS AUCTION IS FOR: 1 Syringe: 8g - 1.4ml
- A ''No Clean'' type paste:
- Paste designed for soldering SMD components.
- It exhibits good tackiness and wet ability of soldered surface.
- The paste does not lose its physical and chemical properties even after being left for 20 hours on the PCB.
- Soldered joints have good mechanical and electrical properties.
- A ''No Clean'' type paste is designed for soldering SMD components introduction processes
- that do not include washing phase.
- Apart from metals powders,
- the product composition includes resin based and solvent based flux,
- activators that remove oxides and thixotropic additions,
- responsible for viscosity and plasticity.
- The paste does not lose its physical and chemical properties even being left for 20 hours on the PCB.
- This time depends on condition in room: humidity and temperature.
- Additional properties of the paste:
- - It does not contain chlorides.
- Flux residue neither corrodes, no requires washing.- - Soldered joints have good mechanical and electrical properties.
- electronics
- electrotechnics
- automatic soldering
- manual soldering
- surface mounting
- for automatic PCBs
- for manual PCBs