Rework, Reflow, Reball, Chip Lift, Assembly and Repairs
Bottle - 100ml
A ''No Clean'' type RF800 Liquid Flux
Colophony based flux of medium activity with excellent wetting properties
This flux wets perfectly soldering surfaces such as: Ag, Cu, Au, Zn, Cd, SnPb and many more.
Good solderability on the surfaces: Ag, Cu, Au, Zn, Cd, SnPb and many more.
Does not require washing.
Gel Flux is condensed rosin of RMA class, intended for BGA/SMD/SMT assembly, repairs and many more applications.
RM800 Liquid Flux can be applied through a small brush.
Activators utilized in flux manufacturing process enable to leave its remnants after soldering on the package ( as far as the process does not include washing phase).
The product composition includes colophony based and solvent based flux, activators that remove oxides and thixotropic additions.
Additional properties of the Liquid Flux:
Machine soldering in professional and consumer electronics
wire end tinning
mixed technologies
soldering passivated surfaces;
It does not contain chlorides.
Flux residue neither corrodes, no requires washing.
Soldered joints have good mechanical and electrical properties.