• Excellent thickness distribution and throwing power
• Easy to manage and control the processes
• High plating rate for fast production
• Smooth and compact surface deposits up to 20 micron thickness
• Range of colors: 18Kt-24Kt
• Low specific gravity of the gold deposits
• High range of current density

This process provides a smooth and shinny 22-24 karat gold electroplating deposit, with high hardness, corrosion and wears resistance. This is use for Heavy Gold plating and also known as Micro gold plating. K22 contains 5 grams of fine gold in every liter of plating solution. Most gold plating baths contain between 0.5-1.5 grams of gold per liter of plating solution. The high content of gold in K22 provides the capability to plate up to 100 times thicker than the standard gold plating bath, presently in the market place.

SRA Solder Dept
24 Walpole Park S
STE: 10
Walpole
MA 02081

Customer Support
Mon - Fri 8:30AM to 5:00PM (EST)