* 100% New Heatsink plaster.
* Application:
apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink,VGA CARD Northbridge
Southbridge Heatsink.
* Special properties: High Conductivity; low bleed; stable at high temperatures.
* Features: thermal properties,
strong adhesion
* Thermal Resistance: <0.246℃ -in² /W
* Type: silicone fluid.
* Physical From: Grease-like
* Evaporation: 0.001% (200 ℃ / 24Hours)
* Thermal conductivity:> 1.5W/m-K
* Dielectric Breakdown: >6.0 KV ac
* Maximum Use Temperature: -20℃~250℃.
* Strength of connected buildings: 25Kg
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* 50ml /PCS , approx 75g