LSM6DS3 Accelerometer Embedded Digital Temperature Sensor Board 8kb FIFO Buffer 5V Breakout Module SPI IIC I2C Interface Module

Feature:
1. Wide Measurement Range: LSM6DS3 accelerometer typically have a large measurement range, enabling them to adapt to various intensities of acceleration and angular velocity in different applications. This versatility allows for accurate measurements across a wide range of motion and vibration scenarios.
2. Fast Response Time: The accelerometer offers a fast response time, allowing it to capture real-time changes in an object's motion and orientation. It provides quick and responsive measurement results, making it suitable for applications that require immediate feedback on movement or posture.
3. Low Power Consumption Design: Designed with low power consumption in mind, this digital temperature sensor board is ideal for long-term operation and applications with limited energy resources. It helps conserve power while maintaining accurate and reliable measurements.
4. Integrated Accelerometer and Gyroscope: This SPI IIC I2C interface module combines the functionality of an accelerometer and gyroscope into a compact package. By integrating the measurements from both sensors, it provides comprehensive motion sensing capabilities, offering a complete solution for motion tracking and attitude estimation.
5. Multiple Digital Interfaces: This breakout module typically support multiple digital interfaces such as I2C and SPI, facilitating communication and data exchange with microcontrollers or other devices. This allows for easy integration into existing systems, making it convenient for developers and engineers to incorporate the accelerometer into their projects.

 

Specification:
Origin: Mainland China
Material: Polymer
Description: The LSM6DS3 is an accelerometer and gyroscope sensor with a huge 8kb FIFO buffer and embedded processing interrupts, specifically designed for the mobile phone market. Because of the power and low cost of the LSM6DS3, we built this small breakout board just for you! Each LSM6DS3 breakout is designed to be flexible and can be specifically configured for many applications. With the LSM6DS3 Breakout, you will be able to detect vibration, tilt, motion, knocks, count steps, and even read temperature!
The LSM6DS3 is capable of reading accelerometer data up to 6.7kS/s and gyroscope data up to 1.7kS/s for more accurate motion sensing. As mentioned earlier, thanks to the LSM6DS3's built-in FIFO, the breakout is also able to buffer up to 8kB of data between reads, host other sensors and drive interrupt pins.
Every pin on the LSM6DS3 is disconnected, with power and I 2 C functions on one side of the board and pins controlling SPI functions and interrupt outputs on the other. Remember that the LSM6DS3 is a 3.3V device, so supplying voltages higher than -3.6V may permanently damage the IC. any development platform running at 5V will require a logic level translator.

Power consumption: 0.9 mA in combined normal mode and 1.25 mA in combined high performance mode (up to 1.6 kHz).
Accelerometers and gyroscopes have low power "always on".
Analogue supply voltage: 1.71V to 5V
SPI/I 2 C serial interface with host processor data synchronisation
Embedded temperature sensor
Size: 19x13x3mm/0.75x0.51x0.12inch

Note:
Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
Please allow 1-2cm measuring deviation due to manual measurement.