* 100% New Heatsink plaster.
* Use for MOSFET, LED, heat sinks , North-south bridge, video card, Chipset, heat dissipation part, heat dissipation, electrical appliances, instruments and other industries.
* Features: thermal properties, strong adhesion
* Melting capacity: 0 (250 ℃ / 24Hours)
* Evaporation: 0.001% (250 ℃ / 24Hours)
* Thermal conductivity:> 1.2W/m-K
* Thermal Impedance: <0.06
* Clotting time: 3min (25 ℃)
* Adhesion and tensile strength(MPa): 2.1
* Insulation coefficient> 5.1
* Dissipation coefficient <0.005
* Temperature resistance: -60 ~ 250 ℃
* Net Weight: 5g
Do not use thermal glue between CPU and HEATSINK