100% brand new
Type: RMA-223
Joint high strength, good immersion
Volume: 10 × 10ml / 10cc
Size: 95 × 35 mm
product manual:
1. Applicable to mobile phone PCB, BGA and PGA and other SMD rework solder paste, the degree of smoke is very low, the electrical interference to mobile phones and other communication products is very small, it is an indispensable welding helper for maintenance personnel.
2. Extensive use of SMD rework process for mobile phone boards.
3.PP environmental protection solder paste is non-toxic, low smoke, no serious odor, no environmental pollution, less residual material, no corrosion
RMA-223 is a high viscosity no-clean flux for PCB, BGA, PGA rework, and soldering and reworking of computer and mobile phone chips.
It is a mixture of high-quality alloy powder and resin paste flux that avoids light yellow residue and is therefore easy to clean.
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Am 16.05.19 hat der Verkäufer die folgenden Angaben hinzugefügt:
