Rocket Scream PCB for Arduino Shield for Reflow Oven - v1.8
YOU ARE BUYING ONLY THE PCB!
Simply can’t afford to buy an industrial reflow oven?Transform your Oven into a Reflow Oven!!!
The shield is meant to be used with an Arduino Uno or Duemilanove.
An accurate thermocouple sensor interface provided by MAX31855KASA+
allows pretty accurate real time temperature acquisition. All you need
is an external Solid State Relay (SSR) (rated accordingly to your oven),
K type thermocouple (we recommend those with fiber glass or steel
jacket), and an oven of course! We provide shematics and example code running the
reflow process utilizing a PID control provided.
Features (not supplied, only PCB)
- Compatible with Arduino Uno and Duemilanove
- Dimension avoids the shorting with the USB connector and the DC jack
- Immersion gold finish allows easier soldering
- 8×2 LCD white character with blue back light
- 2 push button using 1 analog pin
- 1 red LED
- 1 terminal block for thermocouple
- 1 terminal block for SSR to control heating element/oven
- 1 buzzer with transistor for loud and annoying sound
- 1 reset button
- Dimension – 55.88 mm x 53.34 mm
- RoHS compliant – Yes
Reflow Curve Basic
- It is important to understand the basic profile of a reflow curve to
get the best reflow result on your boards. A reflow curve can be
divided into 4 four stages:
- Preheat – The temperature is increase from room
temperature to 150 °C. The ramp up rate must in between 1-3 °C per
seconds. Please ensure that the ramp up rate does not exceed 3 °C per
seconds as the components might experience thermal shock.
- Soak – The soak stage serve as a solder paste
oxides removal process and activating the fluxes. Whenever the
temperature in this stage is too low, solder ball might form. Once
reaching the 200 °C point, the board is said to have achieved a thermal
equilibrium stage and ready for the next reflow stage.
- Reflow – This stage is where the solder paste
reaches the melting point at liquidous temperature which is about 218 °C
for lead free solder paste (Sn-Ag-Cu based). Please ensure that the
board does not stay beyond the recommended 60-90 s duration above this
temperature but still adhering to the maximum 3 °C per second ramp up
rate. Once the peak reflow temperature is reached, the cooling stage
kicks in.
- Cool – The cooling down stage must exhibit a ramp
down rate of not more than 6 °C per seconds during the 245-200 °C range
else thermal shock might occur on the components.
Shipment made with tracking number.