Packaging: -
Series: APF
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA LGA CPU ASIC...)
Attachment Method: Thermal Tape Adhesive (Not Included)
Shape: Square Fins
Length: 1.181 (30.00mm)
Width: 1.181 (30.00mm)
Diameter: -
Height Off Base (Height of Fin): 0.500 (12.70mm)
Power Dissipation @ Temperature Rise: -
Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
Thermal Resistance @ Natural: -
Material: Aluminum
Material Finish: Black Anodized


APF30-30-13CB