10K Leaded Lead-free Solder Ball 0.2~0.76mm BGA Reballing Ball IC Chip Rework




 



QTY: 10K pcs / Bottle
Item: Lead-free / Leaded BGA Reballing Ball
Size: 0.2/0.25/0.3/0.35/0.4/0.45/0.5/0.55/0.6/0.65/0.76mm
Suitable for IC Chip Rework
Balls Alloy: Sn 63 / Pb 37
Feature:
1.Solder (Tin) paste is the best choice of reballing IC.
2.It is used instead of the pin in the IC component package structure.
3.Please Note: There are 10000 pcs/Bottle.The bigger the Reballing Balls, the more loaded it is.If it is a small Reballing balls,the product will only occupy a small space for the bottle.
Package Include:
10000 pcs/bottle
Notice:
1.1cm=10mm=0.39inch.
2.Please allow 1-2mm error due to manual measurement and make sure you do not mind before ordering.
3.Please understand that colors may exist chromatic aberration as the different placement of pictures.







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