KINGBO RMA-218 Soldering Flux Solder Liquid 10cc BGA Reball Mobile Phone PCB PS4

Description

RMA-218 is a High Viscosity No-Clean Flux that can be used for Rework, Sphere or Pin Attachment to BGA, CGA and CSP Packages,

and assembly operations such as Flip Chip attachment to PWB substrates. Good formula for BGA reballing / balls worksit can stick the balls much more.

Can Reflow using Hot Air, Infrared, Oven or Nitrogen Environment. RMA-218 flux Leaves Bright Shiny Solder Joints after Reflow

We are not responsible for any damage caused while attempting any repair and we do not provide instruction of installing.

Specification

Compatibility : Rework / Reflow / Sphere or Pin Attachent to BGA, CGA, CSP

Volume : 10cc

Application Instructions

Apply Flux by Brushing, Dipping, or Direct Dispensing via the Syringe.

Storage

Storage Temperature : 22 to 27 °C / 72 to 80 °F

Store Vertically With The Dispensing Tip Down.

Do Not Freeze Flux Paste

Cleaning

Removal of the flux residue is NOT required. To remove residues, clean with IPA Isopropyl Alcohol.

Package Included:

1 x RMA-218 10CC BGA Reflow / Reball Tacky Flux