1pc Laird TFLEX 380 Thermal Pad 100 x 100 x 2.0 mm 1.2 W/m-K Gap Filler

~ NEW ~

MFG: Laird

MFG PN: TFLEX 380

Product Description

Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of

compliancy allows the material to “totally blanket” the component, enhancing thermal transfer.

The material has a very low compression set enabling the pad to be reused many times.

Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a

thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.

Tflex™ 300H is offered with a hard, metallized liner option for easy handling and improved

rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts

that must slide together, such as a card into a chassis.

Tflex™ 300TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a

guaranteed dielectric barrier, and easier part handling for mass production

FEATURES AND BENEFITS

• Extreme compliancy allows material to “totally blanket” components

• Thermal conductivity of 1.2 W/mK

• Low compression set enables the pad to be reused many times

• Environmentally friendly solution that meets regulatory requirements including RoHS and

REACH