Especificaciones:

General information

• Type CPU / Microprocessor
• Market segment Desktop
• Family Intel Core i3
• Model number i3-7100
• Frequency 3900 MHz
• Bus speed 8 GT/s DMI
• Clock multiplier 39
• Package 1151-land Flip-Chip Land Grid Array
• Socket Socket 1151 / H4 / LGA1151
• Size 1.48" x 1.48" / 3.75cm x 3.75cm

Architecture / Microarchitecture

• Microarchitecture Kaby Lake
• Processor core Kaby Lake-S
• Core stepping S0 (SR35C)
• Manufacturing process 0.014 micron
• Data width 64 bit
• The number of CPU cores 2
• The number of threads 4
• Floating Point Unit Integrated
• Level 1 cache size
  • 2 x 32 KB instruction caches
  • 2 x 32 KB data caches
• Level 2 cache size 2 x 256 KB caches
• Level 3 cache size 3 MB shared cache
• Physical memory 64 GB
• Multiprocessing Uniprocessor
• Features
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 
  • AES / Advanced Encryption Standard instructions
  • AVX / Advanced Vector Extensions
  • AVX2 / Advanced Vector Extensions 2.0
  • BMI / BMI1 + BMI2 / Bit Manipulation instructions
  • F16C / 16-bit Floating-Point conversion instructions
  • FMA3 / 3-operand Fused Multiply-Add instructions
  • EM64T / Extended Memory 64 technology / Intel 64 
  • NX / XD / Execute disable bit 
  • HT / Hyper-Threading technology 
  • VT-x / Virtualization technology 
  • TSX / Transactional Synchronization Extensions
  • MPX / Memory Protection Extensions
  • SGX / Software Guard Extensions
• Low power features
  • Core C1/C1E, C3, C6, C7 and C8 states
  • Package C2, C3, C6, C7 and C8 states
  • Enhanced SpeedStep technology 
• Integrated peripherals / components
• Display controller
  • 3 displays
  • DisplayPort 1.2 / Embedded DisplayPort 1.4 / HDMI 1.4
• Integrated graphics
  • GPU Type: Intel HD 630
  • Microarchitecture: Gen 9 LP
  • Base frequency (MHz): 350
  • Maximum frequency (MHz): 1100
• Memory controller
  • The number of controllers: 1
  • Memory channels: 2
  • Supported memory: DDR3L-1333, DDR3L-1600, DDR4-2133, DDR4-2400
  • DIMMs per channel: 2
  • Maximum memory bandwidth (GB/s): 38.4
• Other peripherals
  • Direct Media Interface 3.0 (4 lanes)
  • PCI Express 3.0 interface (16 lanes)
• Electrical / Thermal parameters
  • Maximum operating temperature 100°C
• Thermal Design Power 51 Watt