QIANLI Knife for iPhone A8 A9 A10 A11 A12 CPU BGA chip, crooked Knife Disassembly Cleaning Pry tool for mobile phone motherboard sealant glue, UV Glue Cleaning Tool and crooked shovel Knife for Removing the motherboard sealant glue, Solder Paste Scraping Knife for cell Phone BGA Repair and UV Glue Cleaning Tool.
Description:
High toughness, high temperature resistance, non-stick tin
With a dual-end anti-slip bar and 3 replacment pry heads for convenient use
Suitable for repairing phone motherboard, removing CPU, removing chips, removing glues without damages
Ultra-thin design allows for easy opening
Lightweight, convenient to carry
List details:
1 x QIANLI 007 Professional Dual-end Metal Bar + 3 Ultra Slim Replacement Pry Heads