Intel Xeon X5570 CPU Quad Core 2.93GHz 8MB SLBF3 Cache LGA1366 Processor

Product Description

General information
Type CPU / Microprocessor
Market segment Server
Family
 
Model number  ? 
 
CPU part numbers
 
  • AT80602000765AA is an OEM/tray microprocessor
  • BX80602X5570 is a boxed microprocessor
Frequency  ?  2933 MHz
Maximum turbo frequency
3333 MHz (1 core)
3200 MHz (4 cores)
Bus speed  ?  6.4 GT/s QPI (3200 MHz)
Package
1366-land Flip-Chip Land Grid Array (FC-LGA8)
1.77" x 1.67" (4.5 cm x 4.25 cm)
Socket Socket 1366 / B / LGA1366
Introduction date March 30, 2009
End-of-Life date
Last order date is September 28, 2012
Last shipment date for tray processors is March 27, 2015
Price at introduction $1386
S-spec numbers
Part number ES/QS processors Production processors
  Q1DY Q1G9 SLBF3
AT80602000765AA + + +
BX80602X5570     +
Architecture / Microarchitecture
Microarchitecture Nehalem
Platform
Tylersburg-EP
Tylersburg-EN
Tylersburg-WS
Processor core  ?  Nehalem-EP
Core steppings  ? 
C1 (Q1DY)
D0 (Q1G9, SLBF3)
CPUID 106A5 (SLBF3)
Manufacturing process
0.045 micron
731 million transistors
Die 263mm2
Data width 64 bit
The number of CPU cores 4
The number of threads 8
Floating Point Unit Integrated
Level 1 cache size  ? 
4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
Level 2 cache size  ?  4 x 256 KB 8-way set associative caches
Level 3 cache size 8 MB 16-way set associative shared cache
Physical memory 144 GB
Multiprocessing Up to 2 processors
Extensions and Technologies
  • MMX instructions
  • SSE / Streaming SIMD Extensions
  • SSE2 / Streaming SIMD Extensions 2
  • SSE3 / Streaming SIMD Extensions 3
  • SSSE3 / Supplemental Streaming SIMD Extensions 3
  • SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4  ? 
  • EM64T / Extended Memory 64 technology / Intel 64  ? 
  • NX / XD / Execute disable bit  ? 
  • HT / Hyper-Threading technology  ? 
  • VT-x / Virtualization technology  ? 
  • VT-d / Virtualization for directed I/O
  • TBT / Turbo Boost technology  ? 
Low power features
  • Thread C1/C1E, C3 and C6 states
  • Core C1/C1E, C3 and C6 states
  • Package C1/C1E, C3 and C6 states
  • Enhanced SpeedStep technology  ? 
Integrated peripherals / components
Integrated graphics None
Memory controller
The number of controllers: 1
Memory channels: 3
Supported memory: DDR3-800, DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 32
ECC supported: Yes
Other peripherals Quick Path Interconnect (2 links)
Electrical / Thermal parameters
V core  ?  0.75V - 1.35V
Minimum/Maximum operating temperature  ? 
5°C - 75°C
5°C - 81°C
Maximum power dissipation  ? 
197.97 Watt
155.56 Watt (sustained)
Thermal Design Power  ?  95 Watt

Package Include：

1 * CPU.

In 100% working order. Photo above is only for illustration purposes. 
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