Product Description
General information | |
Type | CPU / Microprocessor |
Market segment | Desktop |
Family |
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Model number ? |
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CPU part numbers |
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Frequency ? | 3067 MHz |
Maximum turbo frequency |
3333 MHz (1 core)
3200 MHz (2 cores or more)
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Bus speed ? | 4.8 GT/s QPI (2400 MHz) |
Package | 1366-land Flip-Chip Land Grid Array (FC-LGA8) |
Socket | Socket 1366 / B / LGA1366 |
Size | 1.77" x 1.67" / 4.5cm x 4.25cm |
Introduction date | Jun 2, 2009 |
End-of-Life date |
Last order date is June 29, 2012
Last shipment date for tray processors is December 7, 2012
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Price at introduction | $562 |
S-spec numbers | |
Architecture / Microarchitecture | |
Microarchitecture | Nehalem |
Platform | X58 |
Processor core ? | Bloomfield |
Core stepping ? | D0 (Q1HB, SLBEN) |
CPUID | 106A5 (Q1HB, SLBEN) |
Manufacturing process |
0.045 micron Hi-k metal gate technology
731 million transistors
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Die | 263mm2 |
Data width | 64 bit |
The number of CPU cores | 4 |
The number of threads | 8 |
Floating Point Unit | Integrated |
Level 1 cache size ? |
4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches
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Level 2 cache size ? | 4 x 256 KB 8-way set associative caches |
Level 3 cache size | Inclusive shared 8 MB 16-way set associative cache |
Physical memory | 24 GB |
Multiprocessing | Uniprocessor |
Features |
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Low power features |
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Integrated peripherals / components | |
Integrated graphics | None |
Memory controller |
The number of controllers: 1
Memory channels: 3
Supported memory: DDR3-800, DDR3-1066
Maximum memory bandwidth (GB/s): 25.6
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Other peripherals | Quick Path Interconnect (1 link) |
Electrical / Thermal parameters | |
V core ? | 0.8V - 1.375V |
Minimum/Maximum operating temperature ? | 5°C - 67.9°C |
Minimum/Maximum power dissipation ? | 12 Watt (TDP in C6 state) / 230.14 Watt |
Thermal Design Power ? | 130 Watt |
1 * CPU.
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