No Drawing for BGA SMD SMT IC SMT Patch Adhensive Stencil Repair Red Glue




 



Curing Time: 95 seconds
Brand new and high quality
Curing Temperature: up and down heating temperature 150 degrees
Capacity: 30ml
Suitable for: BGA SMD SMT IC repair, etc
Features:
1. No drawing, smearing and pollution phenomena appeared.
2. With strength adhesiveness to bonding variety of surface mount components .
3. Excellent storage stability and good heat resistance.
Notice:
1. The real color of the item may be slightly different from the pictures shown on the website caused by many factors such as brightness of your monitor and light brightness.
2. Please allow slight manual measurement deviation for the data. Thank for your understanding.
3. 1cm=0.39''.
Package Included:
1x 30ml Red Glue
1x Needle




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