Polysynthetic silver thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly.
Weight: 6.0g/tube
Operation Temperature: -50/280°c
Thermal Conductivity: >3.17W/m.k, Thermal Resistance: <0.067°c-in2/w
20% metal oxide compounds
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On Jan 31, 2024 at 06:06:35 PST, seller added the following information:

DataCaciques