138/183℃ Solder Paste Syringe Flux for Soldering SMD BGA IC PCB Needle Tube Tin Solder Paste Welding Paste Welding Components
Ingredient:Sn42Bi58                                    Melting point:138℃
Ingredient:Sn64.7Bi35Ag0.3                      Melting point:183℃
Ingredient:Sn64Bi35Ag1.0  Melting point:172℃/341.6℉
Ingredient:Sn99Ag0.3Cu0.7  Melting point:217℃
Usage: LED strip beads, as well as some paper PCBs or other special soldering that cannot withstand high temperatures.
Usage: Mobile phone repair, tail plug welding, BGA soldering, chip level maintenance, etc
fine paste, suitable for BGA tin planting, chip welding, mobile phone maintenance, electronic welding, LED bulb solder
SMD patch, manual welding and DIY welding materials.
It is equipped with 1 push rod and  needles.