What is ESP8285?

• ESP8285=ESP8266+1M Flash, the bearing high temperature is 125℃ (the one for ESP8266 is just 85℃). More important, the code programmed in ESP8266 can be used for ESP8285 intactly.

• ESP-M3 is encapsulated  by the high performance chip ESP8285, which is equal to ESP8266 chip plus 1M Flash. The chip ESP825 is encapsulated a advanced Tensilica’s L106 32-bit CPU, together with SRAM. ESP825 has the full and complete WiFi fuction, which can used independently and alsoused as a slaver with other Hoster MCU, which can start directly from the out-built Flash. In addition, the built-in high-speed buffer is benefit for the system performance. Especially, ESP8285 can be used as a WiFi adapter by SPI/SDIO and/or I2C/UART interface, when it is applied to the other MCU design.

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• Ultra-small size;

• Support serial to WiFi;

• Wireless transparent transmission;

• Long distance transmission with ultra-low power;

• Bearing high temperature to 125 ℃, compared to the 85℃ for ESP8266.

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SOC characteristics

• Built-in Tensilica L106 ultra-low power 32-bit CPU, main frequency supports 80MHz and160MHz, and RTOS;

• Built-in TCP/IP protocol;

• Built-in one-channel 10-bit high precision ADC;

• Outboard interface: HSPI, UART, I2C, I2S, IR Remote Controk, PWM, GPIO;

• Deep sleep current is 10uA, the cut-off current is smaller than 5uA;

• Wake,connect and transmission data package within 2ms;

• The consume power is smaller 1.0Mw (DTIM3) when at stand by status;

• Built in 1M byte for SPI Flash.

WiFi characteristics

• Support 802.11 b/g/n/e/I;

• Support Station, Soft AP, Soft AP+STA mode;

• Support WiFi Direct (P2P);

• Support CCMP (CBC-MAC, computation mode), TKIP (MIC, RC4), WAPI (SMS4), WEP (RC4), CRC etc., for hardware acceleration.

• P2P finding, P2P GO mode/ GC mode and P2P power manage

• WPA/PA2PSK and WPS;

• 802.11 securitycertification: pre-certification and TSN

• Support 802.11n (2.4GHz);

• 802.1h/RFC1042 frame encapsulation;

• Support seam less roaming;

• Support AT remote update and cloud update (OTA);

• Support Smart Config function (including Android and Ios device).

Module interface

• 2* UART;

• 1*ADC;

• 1*En;

• 1*wakeup pin;

• 1*HSPI;

• 1*I2C;

• 1*I2S

• More than 10*GPIOs

Working temperature: -40℃-+125℃;

Module size: 26.8mm*16mm