| SMD7200B1 solder paste is a halogen-free (no intended added
halogen in formulation), no clean, low voiding solder paste.
SMD7200B1 also shows excellent solderability when reflowed in both air and nitrogen across a wide range of challenging surface finishes including immersion Ag, OSP-Cu, ENIG and CuNiZn. SMD7200B1 is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC. FEATURES AND BENEFITS ● Halogen-free flux: passes IC with pretreatment IPC-TM-650
2.3.34/EN14582 ● Halogen-free flux classification: ROL0 to ANSI/J-STD-004 Rev. B ● Printing: Fine pitch capability (0.3 mm), stencil life (>8 hours),
and abandon time (>4 hours) ● Printing: Suitable for high speed printing up to 150 mm/s ● Reflow: Solderable on challenging surface finishes (CuNiZn and
Copper OSP) ● Colorless residues for easy post-reflow inspection | ||