Model: ICS-490(HT-R490)

Introduction to the Function Characteristics of ICS-490 Three Temperature Zone Intelligent BGA Repair Platform:

Basic parameters:

1. Power supply: single-phase 220V AC 50/60HZ 4KVA (optional 110V)

2. Total power: 4000W, upper heating power: 800W

Bottom heating power: 800W, bottom infrared heating power: 2400W, standby power: ≤ 10W

3. Temperature control method: high-precision K-type thermocouple closed-loop control with electronic temperature compensation.

4. PCB positioning method: V-shaped card slot+Z-shaped universal fixture double Y-direction adjustment

5. Adapt to PCB size: MIN10mm * 10mm MAX350mm * 400mm

6. Infrared preheating area: 210mm * 340mm

7. Machine dimensions: length 586 * width 560 * height 650mm

8. Machine weight: Net weight 26KG

New features:

A: Adopting the globally advanced Intelligent Control System (ICS), abbreviated as "ICS", BGA repair and disassembly are more user-friendly, simplified, and intelligent.

B: Super strong fault alarm function, integrated with the following fault detection and alarm functions in the control system:

1: K-type thermocouple open circuit detection and fault alarm protection. Prevent temperature runaway, temperature overshoot, and other malfunctions from occurring again.

2: Fault detection and fault alarm protection for upper and lower hot air fans. Make the phenomenon of heaters burning out a thing of the past, to maximize the safety of machines and people.

3: Heater fault detection and alarm, making the real-time condition of the machine clear at a glance.

C: Electronic intelligent speed control for hot air flow up and down. Match different temperature curves for each group with different wind speeds to improve repair efficiency and success rate. Eliminating the tedious and repetitive mechanical wind speed adjustment of traditional machines.

D: Adopting a dual Y-direction PCB clamping bracket, it can meet the fixation of larger PCB sizes.

Basic functions:

1. Using high-precision imported raw materials (PLC. heater) to precisely control the disassembly and welding process of BGA

2. The machine adopts three independent temperature zones for more accurate temperature control. Both the first and second temperature zones can be set with 8 stages of temperature rise (fall) and 8 stages of constant temperature control, which can store 10 sets of temperature curves simultaneously. The third temperature zone adopts preheating and independent temperature control, ensuring that the PCB board can be fully preheated during the welding process,

3. Select imported high-precision thermocouples to achieve precise temperature detection

4. Adopting the separate temperature curve method of upper heating and bottom heating, the principle of rapid cooling by the cross flow fan ensures that the PCB will not deform during the welding process

5. Progressive alarm function 20 seconds in advance before disassembly and welding completion, equipped with a vacuum suction pen for easy suction of BGA after disassembly and welding

6. The PCB positioning adopts a V-shaped card slot, which is a flexible and convenient movable universal fixture, providing protection for the PCB

For high heat capacity PCBs and other high-temperature requirements, lead-free soldering can be easily processed

8. The hot air nozzle can rotate 360 degrees freely and is easy to replace.