Carbon Based High Performance Thermal Pad for All Coolers, CPU, IC Processor, 3D Printer, Raspberry Pi, Size and Thickness Choices
Feature:
1. Unique Performance - high thermal conductivity (12.8 W/m.K), ensure heat dissipated quickly & efficiently
2. Unique Performance - balance thermal resistance and viscosity can keep fill the gap, which enhance wettability and improve the thermal conductivity of contact surface
3. Safety Application - non-volatile, flame retardant, metal-free and non-conductive, which eliminates the risk of short circuit and discharges
4. Available Choices - dimensions of 120mm x 20mm, 90mm x 50mm, 120mm x 120mm, 20mm x 20mm, 30mm x 30mm, thicknesses of 0.5mm, 1.0mm, 1.5mm, 2.0mm and 3.0mm
5. Easy to Install - compatible with CPU, Coolers, IC Processor, VGA cards, laptops, game consoles, microcontrollers, memorys, SMD components, Heatsink, 3D Printer, Raspberry Pi and DIY heat dissipation devices etc
Specification:
Product Name: Thermal Pad
Color: Grey
Thermal Conductivity: 12.8 W/m.k
Size: 90 x 50 mm
Thickness: 2.0 mm
Density: 3.38 g/cm3
Hardness(Shore OO): 60±5
Thermal Resistance: 0.25 ℃. in2 / W @10psi)
Volume Resistivity: 1.89 x 10^14 Ω-cm
Breakdown Voltage: 11.44 kV/mm
Flame Retardant: V-0
Silicone-based: Yes
Continuous Use Temperature: -40~150 ℃
Typical Applications: compatible with CPU, Coolers, IC Processor, VGA cards, laptops, game consoles, microcontrollers, memorys, SMD components, Heatsink, 3D Printer, Raspberry Pi etc
What you get:
2 pack silicon thermal pad
1 pack clean package