Product description:

Solder binder with flux produced in the first tin and lead smelting in accordance with PN EN 29453: 2000, in a continuous casting process without air access, then extruded, which ensures the elimination of oxides. The binder is 1.0 mm thick and weighs 250 g, with a tin content of 59.5% to 60.5%, and a melting point of 183 ° C to 190 ° C. The SW26 flux is made on the basis of rosin and an organic halogen activator, which after soldering is "tied up" in rosin, which prevents direct contact with solder and does not cause corrosion, and also facilitates melting and increases solder fluidity. Solder binder is mainly used in the electronics industry, for the production of standard devices and electronic components, and electrical engineering.

Purpose / application:

Solder binder is mainly used in the electronics industry, for the production of standard devices and electronic components, and electrical engineering.

Parameters:

Diameter [mm]: 1

Weight [g]: 250