Qianli 8 in1 For iPhone 14/14P/14 Pro MAX/14 Plus Motherboard Layered Test Middle Frame BGA Reballing Stencil Repair Fixture

Features:

• 8-in-1 motherboard layered test stand reballing platform, Insists on using BeCu spring probes, applicable to Phone 14/14Plus/14Pro/14Pro Max

• Free the repair masters from the layered motherboards the testing problem, save a lot of complicated processes, and make motherboard testing simple and fast

• Reasonable use of limited designed space and innovative design, more stable use with thoughtful design

• To use without a gasket, place the lower motherboard pin board, and upper motherboard in alignment, and stacked them on the base of the test, frame stand in turn

• Place the gasket on the frame base, then place the lower motherboard, pin board, and upper motherboard in alignment and stack on the base of the test frame stand in turn

• The double-headed probe accurately aligns the small holes to improve the contact performance, press the fixed buckle, so that the motherboard will not warp and the testing data is more accurate

• With good conductivity, stable overload, and small and more accurate deviation of test numerical value, the conical probe is not easy to be stained with rosin and solder

• The imported BeCu spring probe has good conductivity stable overload and a small deviation of test numerical value, more professional materials, and effort breed excellent product 

Steps:

• Place the lower motherboard at the base of the test stand

• Fasten the pin board above the lower motherboard

• Place the upper motherboard and buckle it on the pinboard

• Fasten the two wings of the upper cover of the test stand and connect the power supply and screen to start testing