25K 0.2mm~0.75 mm BGA Solder Ball BGA Reballing Balls Lead-free Leaded Repair
Features:
● This product is lead or lead-free, each 11 kinds of specifications, please shoot your model according to your needs.
● 1 Set (0.2 / 0.25 / 0.3 / 0.35 / 0.4 / 0.45 / 0.5 / 0.55 / 0.6 / 0.65 / 0.76)
● Brand new and high quality.
● Solder (Tin) paste is the best choice of reballing IC.
● It is used instead of the pin in the IC component package structure.
● Specification: 0.2mm~0.76 mm (According to your choice)
● Quantity: 25,000Pcs per Bottle
● Lead or Lead-free (According to your choice)
● Composition of Lead-free Solder Ball: Composition of Lead-free Solder Ball: Sn96.5, Ag3, Cu0.5 (96.5% Tin, 3% Silver, 0.5% Copper) ，Melting Point: +217°C● Composition of Leaded Solder Ball: Composition of Lead-free Solder Ball: Sn63, Pb37 (63% Tin, 37% Lead) ，Melting Point: +180°C