Pin spacing: front 1.27mm/back 0.65mm
Level: Double sided
Insulation material: organic resin
Flame retardant properties: VO board
Insulation layer thickness: conventional board
These tiny boards are useful for modding and upgrading SMD components to a DIP footprint.
You can also use these adapters for prototyping by making SMD packages compatible with solderless breadboards.
![](https://image.pushauction.com/0/0/0801f322-6d8b-48e4-b7d4-99ad3c9b70a9/fed007b4-a842-4684-a0bd-ac09355a3b25.jpg)
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