Description

Model:BST-70

Features:

Professional repair tool kit for CPU removal.

Used for BGA repair, removing cell phone CPU chips and cell phone repair.

Stainless steel material, non-deformation, non-stick tin high temperature resistance

Dual head pry knife, five pry knife ten specifications, to meet the de-gumming, tin planting, pry unloading and other cpu disassembly functions.

Can be used to separate the welding point.