Sikama UP4000 Ultra Profile 4000 Reflow Solder/Curing Oven
Comes with what you see in the pictures. If you don't see it, you probably won't get it.
Specifications are from Sikama International and may vary slightly due to upgrades, options, or revisions this unit may or may not have.
This unit is guaranteed to be in working condition. It is a sweeper bar configuration.

The Unit's Serial Number Tag Reads:
Model: Ultra Profile 4000
Serial Number: 02-43-034
Power Requirements: 208 VAC, 3-Phase, 50-60 Hz, 16.8 kW @ 240 VAC
CE Marked: Yes

Description:
Sikama International's versatile Ultra Profile 4000 Solder Reflow oven combines bottom-up conduction with top-down convection heat, precise temperature calibration and purity of atmosphere. The oven can be used as a stand-alone unit or as part of of an automated assembly line using the SMEMA communication standard. It offers multiple load and unload configurations ensuring that it can fit even the most constrained production floors.

The Ultra Profile 4000 is a twelve-zone system with 7 heat zones and 5 cool zones. It features a liquid-cooled load and unload platform, top and bottom conduction plus convection heat zones, and cool zones utilizing liquid cooling. Each top and bottom heat zone has independent set point and gas flow controls to ensure consistent temperatures for greater profile flexibility. The internal cooling zone ensures a process cool-down in an inert atmosphere prior to the product exiting to the offload platform. Parts are transported through the system using sweep bars or walking beams that operate in a "dwell" (timed delay) mode allowing adjustable cycle times. The walking bream transport system minimizes any wear on both components and machine. The system may be operated with air, nitrogen, or forming gas. The gas flow enters the chamber through small orifices in the top and bottom heated platens and exits the sides to prvent contamination of adjoining zones and minimize flux buildup. In addition to heating inert gas, the top platens contribute radiant heat to the reflow process and are easily adjustable to accomodate a broad range of component heights while maintaining accurate temperatures and atmospheres.

Capable of heating up to 752°F (400°C), the UP4000 is targeted at applications involving die soldering, BGAs, flip chips, and insulated metal core substrates. The oven may also be used for processing high-densitity components and substrate materials ranging from copper to ceramice to beryllium, and glass epoxy. The oven is ideally suited for lead frames and Auer Boats.

The UP4000 efficiency of operation and minimal use of electricity and gas, along with small footprint are the results of Sikama's unique design for balanced heating and cooling.

Specifications:
Heating Zones: 7
Cooling Zones: 4
Load/Unload Buffers: Standard
Zone Temperatures: 400°C ±2°C (752°F)
Direction of Flow: Multi-directional
Transport System: Sweeping Bar / Walking Beam (WB)
Automation: SMEMA / SECS/GEM
Minimum O₂ Level: 10 PPM
Substrate Capacity:
  Min/Max Dimensions: No Min., 12" L x 3.9" W (305 mm x 99 mm) Max.
  Maximum Height: 4" (102 mm)
  Maximum Weight: 1 lbs. (0.45 kg) - If all zones used
Facility Requirements:
  Input Voltage: 220 VAC / 380 VAC
  Input Current: ≤ 70 A @ Start-up, @le; 35 A @ Steady state
  System Power: 17 kW @ Start-up, ≤ 8.5 kW @ Stready state
  Total Cover Gas Rate: ≤ 5.8 CFM
  Cooling Water Flow: ≤ 2 GPM
  Dimensions: 38" W x 72" D x 56" H (97 cm x 183 cm x 142 cm)

$150.00 minimum for packaging, handling, and order processing. Shipping to be determined by destination.

Prior to shipment I will need to know the following information (filled out on a form that I will send you) for International Customers or Packages/Freight being Forwarded internationally. International customers may also be subject to a freight forwarder form if applicable.:

(1) Are you the end-user of this item?

(2) If you are not the ultimate end-user of the item, please state the ultimate end user's name.

(3) What is the ultimate country destination?

04/02/24