Package Specifications |
Max CPU Configuration |
1 |
TCASE |
69.8°C |
Package Size |
37.5mm x 37.5mm |
Processing Die Size |
81 mm2 |
# of Processing Die Transistors |
382 million |
Graphics and IMC Lithography |
45 nm |
Graphics and IMC Die Size |
114 mm2 |
# of Graphics and IMC Die Transistors |
177 million |
Sockets Supported |
FCLGA1156 |
Low Halogen Options Available |
See MDDS |
Advanced Technologies |
Intel® Turbo Boost Technology |
Yes |
Intel® vPro Technology |
No |
Intel® Hyper-Threading Technology |
Yes |
Intel® Virtualization Technology (VT-x) |
Yes |
Intel® Trusted Execution Technology |
No |
AES New Instructions |
Yes |
Intel® 64 |
Yes |
Idle States |
Yes |
Enhanced Intel SpeedStep® Technology |
Yes |
Intel® Demand Based Switching |
No |
Thermal Monitoring Technologies |
No |
Execute Disable Bit |
Yes |
Intel® VT-x with Extended Page Tables (EPT) |
Yes |