Specification >>>
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family | AMD Athlon II Dual-Core Mobile |
| Model number | N330 |
| CPU part number | |
| AMN330DCR22GM is an OEM/tray microprocessor | |
| Stepping codes | AAEGC AE NAEGC AE |
| Frequency | 2300 MHz |
| Bus speed | One 1600 MHz 16-bit HyperTransport link (3.2 GT/s) |
| Clock multiplier | 11.5 |
| Package | 638-pin lidless organic micro Pin Grid Array (UOL638) |
| AMD Package number | 30600 |
| Socket | Socket S1 (S1g4) |
| Size | 1.38" x 1.38" / 3.5cm x 3.5cm |
| Weight | 0.2oz / 5.6g (measured) |
| 0.2oz / 6.5g (by specifications) | |
| Introduction date | 12-May-10 |
| End-of-Life date | Last order date is end of 1st quarter 2011 [1] |
| Architecture / Microarchitecture | |
| Microarchitecture | K10 |
| Platform | Danube |
| Processor core | Champlain |
| Core stepping | DA-C3 |
| CPUID | 100F63 |
| Manufacturing process | 0.045 micron silicon-on-insulator (SOI) technology |
| Data width | 64 bit |
| The number of CPU cores | 2 |
| The number of threads | 2 |
| Floating Point Unit | Integrated, 64-bit wide |
| Level 1 cache size | 2 x 64 KB 2-way set associative instruction caches |
| 2 x 64 KB 2-way set associative data caches | |
| Level 2 cache size | 2 x 512 KB 16-way set associative caches |
| Level 3 cache size | None |
| Cache latency [2] | 3 (L1 cache) |
| 15 (L2 cache) | |
| Multiprocessing | Uniprocessor |
| Features | |
| MMX instructions | |
| Extensions to MMX | |
| 3DNow! technology | |
| Extensions to 3DNow! | |
| SSE / Streaming SIMD Extensions | |
| SSE2 / Streaming SIMD Extensions 2 | |
| SSE3 / Streaming SIMD Extensions 3 | |
| SSE4a | |
| AMD64 / AMD 64-bit technology | |
| EVP / Enhanced Virus Protection | |
| AMD-V / AMD Virtualization technology | |
| Low power features | PowerNow! |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 |
| Memory channels: 2 | |
| Supported memory: DDR3-1066, DDR3L-1066 | |
| Maximum memory bandwidth (GB/s): 17.1 | |
| Other peripherals | HyperTransport technology 3.0 |
| Electrical / Thermal parameters | |
| Thermal Design Power | 35 Watt |
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