Code Name |
HADES CANYON |
Essentials |
|
Status |
Launched |
Launch Date |
Q1'18 |
Board
Form Factor |
UCFF (5.5" x 8") |
Socket |
Soldered-down
BGA |
Internal
Drive Form Factor |
M.2 SSD |
# of Internal Drives Supported |
2 |
Lithography |
14 nm |
TDP |
100
W |
DC Input
Voltage Supported |
19 VDC |
Processor Included |
Intel®
Core™ i7-8809G Processor with Radeon™ RX Vega M GH graphics (8M Cache, up to
4.20 GHz) |
Supplemental
Information |
|
Embedded Options Available |
No |
Description |
Other features: Includes 2x Thunderbolt 3 (40Gbps) via rear
USB-C ports, SDXC card slot and front USB-A and USB-C ports w/ USB 3.1 Gen 2 |
Memory & Storage |
|
Max
Memory Size (dependent on memory type) |
32 GB |
Memory Types |
DDR4-2400+
1.2V SO-DIMM |
Max # of
Memory Channels |
2 |
Max Memory Bandwidth |
38.4
GB/s |
Max # of
DIMMs |
2 |
ECC Memory Supported ‡ |
No |
Processor
Graphics |
|
Integrated Graphics ‡ |
Yes |
Graphics
Output |
2x Mini-DP 1.2, 2x Thunderbolt
3, F+R HDMI 2.0a |
# of Displays Supported ‡ |
6 |
Discrete
Graphics |
Radeon™ RX Vega M GH graphics |
Expansion Options |
|
PCI
Express Revision |
Gen3 |
PCI Express Configurations ‡ |
Dual
M.2 slots with PCIe x4 lanes |
Removable
Memory Card Slot |
SDXC with UHS-I support |
M.2 Card Slot (wireless) |
2230 |
M.2 Card
Slot (storage) |
22x42/80, 22x80 |
I/O Specifications |
|
# of USB
Ports |
13 |
USB Configuration |
F:
USB3, 2x USB 3.1g2 (Type A and C); R: 4x USB3, 2x Thunderbolt3 (USB3.1g2);
INT: 2x USB2, 2x USB3 |
USB
Revision |
2.0, 3.0, 3.1 Gen2 |
USB 2.0 Configuration (External + Internal) |
0
+ 2 |
USB 3.0
Configuration (External + Internal) |
1F, 4R, 2i |
Total # of SATA Ports |
2 |
Max # of
SATA 6.0 Gb/s Ports |
2 |
RAID Configuration |
2x
M.2 SATA/PCIe SSD (RAID-0 RAID-1) |
Audio
(back channel + front channel) |
7.1 digital; L+R+mic (F);
L+R+TOSLINK (R) |
Integrated LAN |
2x
10/100/1000 |
Integrated
Wireless‡ |
Intel® Wireless-AC 8265 +
Bluetooth 4.2 |
Integrated Bluetooth |
Yes |
Consumer
Infrared Rx Sensor |
Yes |
S/PDIF Out Connector |
TOSLINK |
Additional
Headers |
CEC, 2x USB2.0, 2x USB 3.0,
FRONT_PANEL |
# of Thunderbolt™ 3 Ports |
2 |
Advanced
Technologies |
|
Intel® Virtualization Technology for Directed I/O
(VT-d) ‡ |
Yes |
Intel®
vPro™ Platform Eligibility ‡ |
No |
TPM |
No |
Intel®
HD Audio Technology |
Yes |
Intel® Rapid Storage Technology |
Yes |
Intel®
Virtualization Technology (VT-x) ‡ |
Yes |
Intel® Platform Trust Technology (Intel® PTT) |
Yes |
Security
& Reliability |
|
Intel® AES New Instructions |
Yes |