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EXCELLENT THERMAL CONDUCTIVITY: 85x45mm Upgraded thermal silica gel material is rated voltage up to 9.8KV and has a thermal conductivity of 12.8 W/mK thermal conductivity. Thermal pad greatly improve the heat transfer between the electronic elements and effectively cool the temperature down in seconds.
SUPER RELIABLE & DURABLE: High temperature performance in -40 ℃ to 200 ℃ will not melt, non-toxic, odourless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort.
EASY & CONVENIENT TO USE: Dimension 85x45mm, the thermal pads can be cut freely according to your needs, perfect to filled contact surfaces gap, a great assistant for both beginners and professionals.
WIDELY APPLICATION: Perfectly replaces traditional heatsink compound grease paste, great for Notebook computers, Graphics Cards, DRAM memory modules, communication devices, SSD, hard drives, car control devices and game equipments, etc.
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