Low-density copper foam 20MM thick copper foam Porous foam copper for solar heat dissipation applications Nickel-copper alloy foam 100PPI

20MM*100MM*100MM
Foam copper description:
Aperture: 0.1mm-10mm
Porosity: 60%-98%
Through hole rate: ≥98%
Bulk density: 0.1-0.8g/cm3
ppi (number of holes per inch): 5-130
Tensile strength: 5-18KPa
Compressive strength: ≥250KPa
Mechanical strength: ≥2-5Mpa
High temperature resistance≥900℃
Heat transfer coefficient＞6W/(m2K)

Uses: heat dissipation materials, heat absorption materials, chemical catalyst carriers, electromagnetic screen materials, filter materials, damping materials, battery electrode materials, sound-absorbing materials, high-grade decorative materials