Intel Core i9-13900KS. Processor family: Intel® Core™ i9, Processor socket: LGA 1700, Processor manufacturer: Intel. Memory channels: Dual-channel, Maximum internal memory supported by processor: 192 GB, Memory types supported by processor: DDR4-SDRAM, DDR5-SDRAM. On-board graphics card model: Intel UHD Graphics 770, On-board graphics card outputs supported: Embedded DisplayPort (eDP) 1.4b, DisplayPort 1.4a, HDMI 2.1, On-board graphics card base frequency: 300 MHz. Market segment: Desktop, Use conditions: PC/Client/Tablet, PCI Express slots version: 5.0, 4.0. Intel® Turbo Boost Max Technology 3.0 frequency: 5.8 GHz, Intel® Thermal Velocity Boost Frequency: 6 GHz

Intel® Gaussian & Neural Accelerator

Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speed-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.



Intel® Deep Learning Boost (Intel® DL Boost)

A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.



Intel® Speed Shift Technology

Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.



Intel® Thermal Velocity Boost

Intel® Thermal Velocity Boost (Intel® TVB) is a feature that opportunistically and automatically increases clock frequency above single-core and multi-core Intel® Turbo Boost Technology frequencies based on how much the processor is operating below its maximum temperature and whether turbo power budget is available. The frequency gain and duration is dependent on the workload, capabilities of the processor and the processor cooling solution.



Intel® Turbo Boost Max Technology 3.0

Intel® Turbo Boost Max Technology 3.0 identifies the best performing core(s) on a processor and provides increased performance on those cores through increasing frequency as needed by taking advantage of power and thermal headroom.



Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.



Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.



Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.



Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.



Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.



Intel® Volume Management Device (VMD)

Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.

Processor
Processor family	Intel® Core™ i9
Processor cores	24
Processor socket	LGA 1700
Box	Yes
Cooler included	No
Processor manufacturer	Intel
Processor model	i9-13900KS
Processor operating modes	64-bit
Processor generation	13th gen Intel® Core™ i9
Processor threads	32
Performance cores	8
Efficient cores	16
Processor boost frequency	6 GHz
Performance-core boost frequency	5.4 GHz
Performance-core base frequency	3.2 GHz
Efficient-core boost frequency	4.3 GHz
Efficient-core base frequency	2.4 GHz
Processor cache	36 MB
Processor cache type	Smart Cache
Processor base power	150 W
Maximum turbo power	253 W
Stepping	B0
Bus type	DMI4
Maximum number of DMI lanes	8
Memory bandwidth supported by processor (max)	89.6 GB/s
Processor codename	Raptor Lake
Processor ARK ID	232167
Memory
Memory channels	Dual-channel
Maximum internal memory supported by processor	192 GB
Memory types supported by processor	DDR4-SDRAM, DDR5-SDRAM
ECC	Yes
Non-ECC	Yes
Memory bandwidth (max)	89.6 GB/s
Graphics
On-board graphics card	Yes
Discrete graphics card	No
On-board graphics card model	Intel UHD Graphics 770
Discrete graphics card model	Not available
On-board graphics card outputs supported	Embedded DisplayPort (eDP) 1.4b, DisplayPort 1.4a, HDMI 2.1
On-board graphics card base frequency	300 MHz
On-board graphics card dynamic frequency (max)	1650 MHz
Number of displays supported (on-board graphics)	4
On-board graphics card DirectX version	12.0
On-board graphics card OpenGL version	4.5
On-board graphics card maximum resolution (DisplayPort)	7680 x 4320 pixels
On-board graphics card maximum resolution (eDP - Integrated Flat Panel)	5120 x 3200 pixels
On-board graphics card maximum resolution (HDMI)	4096 x 2160 pixels
On-board graphics card refresh rate at maximum resolution (DisplayPort)	60 Hz
On-board graphics card refresh rate at maximum resolution (eDP - Integrated Flat Panel)	120 Hz
On-board graphics card refresh rate at maximum resolution (HDMI)	60 Hz
On-board graphics card ID	0xA780
Number of execution units	32
Multi-Format Codec Engines	2
Features
Execute Disable Bit	Yes
Idle States	Yes
Thermal Monitoring Technologies	Yes
Market segment	Desktop
Use conditions	PC/Client/Tablet
Maximum number of PCI Express lanes	20
PCI Express slots version	5.0, 4.0
PCI Express configurations	1x16+1x4, 2x8+1x4
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Scalability	1S
CPU configuration (max)	1
Embedded options available	No
Direct Media Interface (DMI) Revision	4.0
Export Control Classification Number (ECCN)	5A992C
Commodity Classification Automated Tracking System (CCATS)	740.17B1
Processor special features
Intel® Hyper Threading Technology (Intel® HT Technology)	Yes
Intel® Turbo Boost Technology	2.0
Intel® Quick Sync Video Technology	Yes
Intel® Clear Video HD Technology (Intel® CVT HD)	Yes
Intel® AES New Instructions (Intel® AES-NI)	Yes
Enhanced Intel SpeedStep Technology	Yes
Intel Trusted Execution Technology	Yes
Intel® Speed Shift Technology	Yes
Intel® Thermal Velocity Boost	Yes
Intel® Adaptive Boost Technology	Yes
Intel® Turbo Boost Max Technology 3.0 frequency	5.8 GHz
Intel® Gaussian & Neural Accelerator (Intel® GNA) 3.0	Yes
Intel® Thermal Velocity Boost Frequency	6 GHz
Intel® Control-flow Enforcement Technology (CET)	Yes
Intel® Thread Director	Yes
Intel VT-x with Extended Page Tables (EPT)	Yes
Intel® Secure Key	Yes
Intel® Active Management Technology (Intel® AMT)	Yes
Intel Stable Image Platform Program (SIPP)	Yes
Intel® OS Guard	Yes
Intel 64	Yes
Intel Virtualization Technology (VT-x)	Yes
Intel Virtualization Technology for Directed I/O (VT-d)	Yes
Intel Turbo Boost Max Technology 3.0	Yes
Intel® Boot Guard	Yes
Intel® Deep Learning Boost (Intel® DL Boost)	Yes
Intel® Volume Management Device (VMD)	Yes
Mode-based Execute Control (MBE)	Yes
Intel® vPro™ Platform Eligibility	Yes
Intel® Standard Manageability (ISM)	Yes
Intel® One-Click Recovery	Yes
Intel® Stable IT Platform Program (SIPP)	Yes
Intel® Remote Platform Erase (RPE)	Yes
Intel® Virtualization Technology with Redirect Protection (VT-rp)	Yes
Intel vPro® Enterprise Platform Eligibility	Yes
Intel® Threat Detection Technology (TDT)	Yes
Intel® Hardware Shield Eligibility	Yes
Intel® Total Memory Encryption - Multi Key	Yes
Intel vPro® Essentials Platform Eligibility	Yes
Operational conditions
Tjunction	100 °C
Technical details
OpenCL version	3.0
Logistics data
Harmonized System (HS) code	8542310001
Packaging data
Package type	Retail box
Other features
L2 cache	32768 KB
Maximum internal memory	192 GB
Technical details
Target market	Gaming, Content Creation
Launch date	Q1'23
Status	Launched
Other features
Graphics output	eDP 1.4b, DP 1.4a, HDMI 2.1