BGA Heated Directly Reballing Stencil | |
Thickness | T=0.12mm |
Material | Steel |
Quantity | 1 Piece |
Weight | 26g |
Lead-free Solder Paste | |
Alloy | Sn42Bi58 |
Melting Point | 138°C/280°F |
Storage Conditions | 0°C ~ 45°C |
Shelf life | 6 months after opening |
Weight | 50g/Bottle |
Suitable for | LED patches, SMT patches, BGA soldering and IC Chip Repair |
Estimated Delivery Time | ||
Country/Region |
Standard (Business Days) |
Express (Business Days) |
UK, EU (27 Countries) | 6 - 12 | 4 - 6 |
Other European Countries | 6 - 15 | 4 - 7 |
USA, Canada, Mexico | 5 - 10 | 3 - 5 |
Australia, New Zealand, South Asia, East Asia | 7 - 12 | 3 - 5 |
South America, Other Countries/ Regions | 15 - 25 | varying |