| Mfr Package Description | 14 X 14 MM, 2 MM HEIGHT, COPPER LEAD FRAME, PLASTIC, QFP-80 |
| Status | In Stock |
| Telecom IC Type | FRAMER |
| Carrier Type | T-1(DS1) |
| JESD-30 Code | S-PQFP-G80 |
| JESD-609 Code | e0 |
| Moisture Sensitivity Level | 3 |
| Number of Functions | 1 |
| Number of Terminals | 80 |
| Operating Temperature-Min | -40 Cel |
| Operating Temperature-Max | 85 Cel |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | QFP |
| Package Equivalence Code | QFP80,.7SQ |
| Package Shape | SQUARE |
| Package Style | FLATPACK |
| Peak Reflow Temperature (Cel) | 225 |
| Power Supplies (V) | 5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2.35 mm |
| Sub Category | Other Telecom ICs |
| Supply Current-Max | 90 mA |
| Supply Voltage-Nom | 5 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.6500 mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Length | 14 mm |
| Width | 14 mm |