| Mfr Package Description | METRIC, PLASTIC, TQFP-100 |
| Status | In Stock |
| Telecom IC Type | MODEM |
| Data Rate | 56.0 |
| JESD-30 Code | S-PQFP-G100 |
| JESD-609 Code | e0 |
| Number of Functions | 1 |
| Number of Terminals | 100 |
| Operating Temperature-Min | 0.0 Cel |
| Operating Temperature-Max | 70.0 Cel |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | LFQFP |
| Package Equivalence Code | QFP100,.63SQ,20 |
| Package Shape | SQUARE |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | NOT APPLICABLE |
| Qualification Status | Not Qualified |
| Seated Height-Max | 1.6 mm |
| Sub Category | Modems |
| Supply Voltage-Nom | 3.3 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | TIN LEAD |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.5 mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | NOT APPLICABLE |
| Length | 14.0 mm |
| Width | 14.0 mm |