Mfr Package Description | METRIC, PLASTIC, TQFP-100 |
Status | In Stock |
Telecom IC Type | MODEM |
Data Rate | 56.0 |
JESD-30 Code | S-PQFP-G100 |
JESD-609 Code | e0 |
Number of Functions | 1 |
Number of Terminals | 100 |
Operating Temperature-Min | 0.0 Cel |
Operating Temperature-Max | 70.0 Cel |
Package Body Material | PLASTIC/EPOXY |
Package Code | LFQFP |
Package Equivalence Code | QFP100,.63SQ,20 |
Package Shape | SQUARE |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH |
Peak Reflow Temperature (Cel) | NOT APPLICABLE |
Qualification Status | Not Qualified |
Seated Height-Max | 1.6 mm |
Sub Category | Modems |
Supply Voltage-Nom | 3.3 V |
Surface Mount | YES |
Technology | CMOS |
Temperature Grade | COMMERCIAL |
Terminal Finish | TIN LEAD |
Terminal Form | GULL WING |
Terminal Pitch | 0.5 mm |
Terminal Position | QUAD |
Time@Peak Reflow Temperature-Max (s) | NOT APPLICABLE |
Length | 14.0 mm |
Width | 14.0 mm |