This auction is for 2 PCs -  Transcend 128GB PCIe/ NVMe M.2 2280 SSD

Condition
+ New
+ OEM Package
+ 100% Tested before Shipping
+ SSD only

Specifications

Transcend's MTE652T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications, delivering unparalleled transfer speeds. The MTE652T2 features the latest 3D NAND technology for higher storage efficiency, 30µ" PCB gold finger and Corner Bond technology for enhanced durability, built-in DRAM cache for fast access, an extended operating temperature range from -20°C to 75°C, and an endurance rating of 3K Program/Erase cycles for reliable operation.



MTE652T2

Transcend's MTE652T2 M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications, delivering unparalleled transfer speeds. The MTE652T2 features the latest 3D NAND technology for higher storage efficiency, 30µ" PCB gold finger and Corner Bond technology for enhanced durability, built-in DRAM cache for fast access, an extended operating temperature range from -20°C to 75°C, and an endurance rating of 3K Program/Erase cycles for reliable operation.


Technologies

96-layer 3D NAND Flash

30µ” PCB Gold Finger

Corner Bond

Extended Temperature

Dynamic Thermal Throttling

Thermal Sensor

Read Disturbance

Anti-Sulfur Technology

Garbage Collection

Wear Leveling

TRIM

Bad Block Management

Power Shield (PS)

Early Move

Firmware Features

  • Supports NVM command
  • Dynamic thermal throttling
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection

Hardware Features

  • Compliant with NVM Express specification 1.3
  • Compliant with PCI Express specification 3.1
  • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
  • PCIe Gen 3 x4 interface
  • DDR3 DRAM Cache embedded
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Key components fortified by default with Corner Bond technology
  • 30µ" PCB gold finger
  • Anti-sulfur technology implemented to prevent sulfurization in the environment
  • Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
  • Promised operational reliability in an extended temperature range (from -20°C to 75°C)

Appearance

Dimensions80 mm x 22 mm x 3.58 mm (3.15" x 0.87" x 0.14")
Weight9 g (0.32 oz)
M.2 Type
  • 2280-D2-M (Double-sided)
Form Factor
  • M.2 2280

Interface

Bus Interface
  • NVMe PCIe Gen3 x4

Storage

Capacity
  • 128 GB
Flash Type
  • 3D NAND flash

Operating Environment

Operating Voltage
  • 3.3V±5%
Operating Temperature
  • Extended Temp.
    -20°C (-4°F) ~ 75°C (167°F)
Storage Temperature-55°C (-67°F) ~ 85°C (185°F)
Humidity5% ~ 95%
Shock
  • 1500 G, 0.5 ms, 3 axis
Vibration (Non-operating)20 G (peak-to-peak), 7 Hz ~ 2000 Hz (frequency)

Power

Power Consumption (Operation)3.0 watt(s)
Power Consumption (IDLE)0.6 watt(s)

Performance

Sequential Read/Write (CrystalDiskMark)Read: Up to 2,100 MB/s
Write: Up to 1,250 MB/s
4K Random Read/Write (IOmeter)Read: Up to 190,000 IOPS
Write: Up to 290,000 IOPS
Mean Time Between Failures (MTBF)3,000,000 hour(s)
Terabytes Written (TBW)Up to 1,080 TBW
Drive Writes Per Day (DWPD)2 (3 yrs)
Note
  • Speed may vary due to host hardware, software, usage, and storage capacity.
  • The workload used to rate DWPD may be different from your actual workload, which may vary due to host hardware, software, usage, and storage capacity.
  • Terabytes Written (TBW) expresses the endurance under the highest capacity.