| Mfr Package Description | 14 X 22 MM, PLASTIC, MS-028BHA, BGA-119 |
| Status | In Stock |
| Technology | CMOS |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Surface Mount | Yes |
| Terminal Form | BALL |
| Terminal Pitch | 1.27 mm |
| Terminal Position | BOTTOM |
| Number of Functions | 1 |
| Number of Terminals | 119 |
| Package Body Material | PLASTIC/EPOXY |
| Temperature Grade | INDUSTRIAL |
| Memory Width | 18 |
| Organization | 512K X 18 |
| Memory Density | 9.44E6 deg |
| Operating Mode | SYNCHRONOUS |
| Number of Words | 524288 words |
| Number of Words Code | 512K |
| Operating Temperature-Max | 85 Cel |
| Operating Temperature-Min | -40 Cel |
| Supply Voltage-Max (Vsup) | 3.46 V |
| Supply Voltage-Min (Vsup) | 3.14 V |
| Supply Voltage-Nom (Vsup) | 3.3 V |
| Memory IC Type | ZBT SRAM |
| Parallel/Serial | PARALLEL |
| Access Time-Max (tACC) | 4.2 ns |