| Mfr Package Description | BGA-324 |
| REACH Compliant | - |
| Status | In Stock |
| Address Bus Width | 32.0 |
| Boundary Scan | NO |
| Bus Compatibility | PENTIUM II; PENTIUM III |
| Clock Frequency-Max | 133.0 MHz |
| External Data Bus Width | 64.0 |
| JESD-30 Code | S-PBGA-B324 |
| Moisture Sensitivity Level | 1 |
| Number of I/O Lines | 0.0 |
| Number of Terminals | 324 |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | BGA |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 225 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 2.59 mm |
| Surface Mount | YES |
| Technology | CMOS |
| Terminal Form | BALL |
| Terminal Pitch | 1.27 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 27.0 mm |
| Width | 27.0 mm |