Mfr Package Description | BGA-324 |
REACH Compliant | - |
Status | In Stock |
Address Bus Width | 32.0 |
Boundary Scan | NO |
Bus Compatibility | PENTIUM II; PENTIUM III |
Clock Frequency-Max | 133.0 MHz |
External Data Bus Width | 64.0 |
JESD-30 Code | S-PBGA-B324 |
Moisture Sensitivity Level | 1 |
Number of I/O Lines | 0.0 |
Number of Terminals | 324 |
Package Body Material | PLASTIC/EPOXY |
Package Code | BGA |
Package Shape | SQUARE |
Package Style | GRID ARRAY |
Peak Reflow Temperature (Cel) | 225 |
Qualification Status | Not Qualified |
Seated Height-Max | 2.59 mm |
Surface Mount | YES |
Technology | CMOS |
Terminal Form | BALL |
Terminal Pitch | 1.27 mm |
Terminal Position | BOTTOM |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Length | 27.0 mm |
Width | 27.0 mm |