Features:
1.6 in 1 design, which can implant a plurality of chips.
4.It is easy and fast for reballing the BGA IC, useful and economical accessories for BGA soldering.
5. It is specially designed for BGA153/ 162/ 169/ 186/ 221/ 254/ EMMC.
Specifications:
Material: High Quality Stainless Steel
Weight: Approx. 6g
Compatible with: BGA221, BGA153, BGA169, BGA254, BGA162, BGA186
Package Included:
1 x BGA stencils
Note:
1.Please allow 1-3 cm error due to manual measurement. Thanks for your understanding.
2.Monitors are not calibrated same, item color displayed in photos may be showing slightly different from the real object. Please take the real one as standard.
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