| Mfr Package Description | 0.300 INCH, PLASTIC, DIP-24 |
| Status | In Stock |
| JESD-30 Code | - |
| JESD-609 Code | - |
| Number of Terminals | 24 |
| Operating Temperature-Min | 0.0 Cel |
| Operating Temperature-Max | 70.0 Cel |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | DIP |
| Package Equivalence Code | DIP24,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies | 5 |
| Qualification Status | Not Qualified |
| Seated Height-Max | 4.953 mm |
| Sub Category | Other Microprocessor ICs |
| Supply Voltage-Nom | 5.0 V |
| Supply Voltage-Min | 4.75 V |
| Supply Voltage-Max | 5.25 V |
| Surface Mount | NO |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54 mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Length | 31.75 mm |
| Width | 7.62 mm |