Magnetic Reballing BGA Stencil Tin Transform Plant Platform for iPhone CPU Chip A8-A16 Hisilicon Qualcomm A8 A9 A10 A11 A12 A13 A14 A15 A16/ Android Solder Kit

    Support Apple iPhone series,Hisilicon series, Qualcomm series.
    BGA maintenance positioning
    Make your repair work easier.
    All the plate boards are in Brand New condition

Reballing Stencil Description:
    CPU Solder Template kit
    High Quality Stainless Steel Reballing Stencil.
    Specially Designed for iPhone A8 A9 A10 A11 A12 A13 A14 A15 A16/ Android
    Specially Designed for iPhone 11/11Pro/11Pro Max/12/12Pro/12Pro Max/12Mini/13/13Pro/13Pro Max /14 pro /14 pro max.

Platform Description:
●Product size: 10x7.5x1.4 CM
●Great repairing tool for BGA Reballing Rework
●Used to easily and quickly resolder tin on the CPU
●High-temperature resistant that can be heated directly by the hot air gun
●Clear distinction, help you reduce the probability of misjudgment